BGA-Top-78 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-0517 features a ZIF (Zero Insertion Force) socket that is designed to accept a wide range of BGA (Ball Grid Array) packages with varying ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter’s picture showcases the range of dimensions of BGA packages that can be accommodated by this BGA-Top board.

The ZIF socket on this BGA adapter has an operating (mechanical) warranty of 500,000 actuations, providing a high level of durability and reliability for repeated use during programming or testing applications.

This BGA adapter is made in Slovakia, adhering to high-quality manufacturing standards to ensure reliable performance. The Ord. no. 70-0517 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment.

The ZIF socket on the top board of the BGA adapter is of ClamShell type, which allows for easy insertion and removal of BGA packages without the need for additional tools. The ClamShell design provides a hinged cover that securely holds the BGA package in place during programming or testing, and can be easily opened to insert or remove the BGA package.

The top board of the BGA adapter features a connection to BGA-Bottom-X with 4 rows of 4×25 pins arranged in a square pattern, with a pin spacing of 0.6×0.6mm. This allows for a secure and reliable connection between the top and bottom boards of the BGA adapter, ensuring efficient communication during programming or testing of BGA packages.