BGA-Top-48 ZIF

The top board of the BGA adapter with Ord. no. 70-0446 is designed to accommodate various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board is designed to accept BGA80 packages, which can have up to 120 balls.

The ZIF socket has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and longevity for repeated device insertion and removal operations. It is of the OpenTop type, which makes it easy to insert and remove BGA packages without applying excessive force or risking damage to the device or the adapter.

The top board of the BGA adapter is made in Slovakia to high-quality standards, ensuring reliable performance. The Ord. no. 70-0446 serves as a unique identifier for this specific adapter, making it easy to identify and track in a professional environment.

The top board of the BGA adapter features a connection to the BGA-Bottom board with 4 rows of 4x 25 pins each, arranged in a square pattern with a pin spacing of 0.6×0.6mm. This connection is designed to provide a reliable electrical connection to the BGA-Bottom board, allowing for efficient and accurate testing, programming, or other operations with BGA devices.

It is important to verify the compatibility of the BGA adapter with the specific BGA package type and specifications before proceeding with any operations to ensure proper functionality and avoid potential damage to the BGA device or the adapter. The picture at the “Accepted package(s)” section of the adapter should be referred to for identifying the range of dimensions of BGA packages that are accepted by this specific BGA-Top board.