The top board of the BGA adapter is designed to accept various variations of BGA (Ball Grid Array) packages, which may differ in ball diameter, ball height, and body thickness. The BGA-Top board features a ZIF (Zero Insertion Force) socket with a ClamShell type design, known as ZIF BGA120 (depopulated array of (64) spring probes), which allows for easy insertion and removal of BGA packages during testing and programming.
The ZIF socket on the BGA-Top board has an operating (mechanical) warranty of 500,000 actuations, indicating its durability and longevity for repeated use. This makes it suitable for high-volume production and testing environments where frequent actuations are required.
The BGA-Top board is made in Slovakia, known for its quality manufacturing, and is identified by the Ord. no. 70-0243. The connection to the BGA-Bottom-X (bottom board) is achieved through 4 rows with 4×25 pins each, arranged in a square pattern with a pitch of 0.6×0.6mm (600 mil) between the rows. This configuration allows for a secure and reliable connection to the BGA-Bottom-X during testing and programming.
The BGA-Top board with a ZIF BGA120 ClamShell socket, 4×25 pins in a square pattern with a pitch of 0.6×0.6mm (600 mil) row spacing, and an operating (mechanical) warranty of 500,000 actuations, made in Slovakia, and identified by Ord. no. 70-0243, is a reliable option for testing and programming various variations of BGA packages, providing durability, versatility, and ease of use for testing and programming needs in high-volume production environments.
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