BGA-Top-182 ZIF-CS

The top board of BGA adapters is designed to accommodate various BGA packages with different ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board is of BGA64 type with a ClamShell design, allowing for easy insertion and removal of BGA64 packages without applying excessive force, reducing the risk of damage to the device or the adapter. The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during repeated usage.

This top board of BGA adapters is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0964 for easy identification and ordering. The socket is designed to connect with BGA-Bottom-X using 4×25 pins arranged in a square configuration with a size of 0.6×0.6mm, providing a reliable and robust connection to the target device.

The top board of BGA adapters is designed to accept a wide range of BGA packages with varying dimensions, and it is made in Slovakia with an order number of 70-0964. It features a ZIF BGA64 ClamShell socket with an operating (mechanical) warranty of 500,000 actuations, making it a reliable and durable solution for BGA package testing and programming.