BGA-Top-119 ZIF

The top board of BGA adapters is designed to accept various variations of BGA (Ball Grid Array) packages, including different ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board has an operating mechanical warranty of 10,000 actuations, ensuring durability and reliability during repeated use.

This top board is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0955 for easy identification and ordering. The ZIF socket is designed for BGA484 packages and features an OpenTop type, allowing for easy insertion and removal of the BGA packages.

The top board also features 8×50+2×50 pins for B-T-B (Board-to-Board) connectors, with a pitch of 0.8mm, providing reliable and secure connections to the bottom board. The accepted package(s) section of the top board shows the range of dimensions for BGA packages that are compatible with this board, including ball diameter, ball height, and body thickness.