| Type | ETA | Cost | |
 |
Inside UAE | 2 - 3 Days | 22 AED |
|---|---|---|---|
|
|
Pickup | 1 Day | Free |
|
|
International | 4 - 7 Days | 100 AED |
International Delivery
International
4 - 7 Days
Will be calculated at checkout
Self Pickup
Pickup
Sameday
Free
Inside UAE Delivery
Inside UAE
2 - 3 Days
AED 29/-
Payment Methods:
The XGSP50 is a solder paste that comes in a 42g net weight. It is composed of Sn63/Pb37 alloy and has a microns size range of 20-38um. This product is ideal for repairing phones, CPUs, and chips. The welding spot created by this solder paste is white and full, and it leaves no rosin joint.
Sn63/Pb37 alloy composition
Microns size range of 20-38um
42g net weight
Ideal for phone repair, CPU repair, and chip repair
Creates a white and full welding spot
Leaves no rosin joint
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