Specifications:
Material: plastic + solder paste
Size: approx. 37 * 22 mm
Model: XGSP40
Alloy: Sn63 / Pb37
Micron: 20-38um
Melting point: 183 degrees Celsius
Applications: Mobile phone repair, computer and digital services industries, high precision circuit board SMT soldering, BGA soldering processes, etc.
Reviews
Clear filtersThere are no reviews yet.