“The Thermal Adhesive Tape is a practical and easy-to-use solution for effective thermal dissipation in electronic devices. With high thermal conductivity, insulation, and strong stickiness, this tape ensures optimal performance. It outperforms generic pads with a thermal conductivity of 2.0 W/mK. Its softness and compression properties allow it to fill uneven surfaces and securely bond heat source devices, heat sinks, IC chips, and high-power LEDs for efficient thermal management. The tape is widely used in various electronic applications, making it a versatile and reliable choice for thermal solutions.
Dimension: 10mm x 25m (Width x Length)
Glass fiber thickness: 0.2mm
Thermal Conductivity: 2W/m-k
Breakdown Voltage: 5KVAC Thermal impedance : 0.3℃in2/w
Initial Adhesion: 1.5kg/inch
Reviews
Clear filtersThere are no reviews yet.