NO CLEAN FLUX

This is a flux paste that is used for touch up and repair of surface mount assemblies. It contains a unique mixture of high grade synthetic resin and thixotropic agents that promote fast wetting action and maximum wetting spread. The flux paste is designed specifically for use with high temperature lead free and conventional Sn/Pb alloys. It has excellent wettability, is no clean, and leaves non-conductive, non-tacky residues. It is compatible with both lead free and leaded solder systems and is RoHS compliant. The flux paste has been tested and classified as R0L0 according to JSTD-004 standards. It has also passed tests for copper mirror, silver chromate, corrosion, SIR, Bellcore (Telecordia), and electromigration according to various test methods.