BGA-Top-94 ZIF

The top board of BGA adapters with Ord. no. 70-0600 is designed to accept various BGA (Ball Grid Array) packages with different ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board is of the OpenTop type, providing easy insertion and removal of BGA devices during programming or testing.

The accepted package(s) for this BGA-Top board are depicted in the picture at the Accepted package(s) section, which shows the range of all dimensions of BGA packages that can be accommodated by this adapter. This allows for flexibility and versatility in programming or testing different BGA devices with varying specifications.

The ZIF socket on the top board has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and reliable performance during repeated use. The adapter is made in Slovakia, known for its high-quality manufacturing standards.

The connection to the BGA-Bottom-X is designed with 8+3 rows of pins, with 8×25 pins in the main area and 3×20 pins in a smaller area, arranged in a square pattern with a pin pitch of 0.6×0.6mm. This configuration is compatible with the pinout of BGA devices requiring this type of connection, ensuring proper alignment and connection during programming or testing.