The top board of the BGA adapter with Ord. no. 70-0532 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, including different ball diameters, ball heights, and body thicknesses. The accepted package dimensions are indicated in the picture at the “Accepted package(s)” section of the adapter.
The ZIF socket on the top board has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and reliability during repeated insertions and removals of BGA packages.
The top board of the BGA adapter is made in Slovakia, adhering to high-quality manufacturing standards to ensure optimal performance and reliability.
The Ord. no. 70-0532 serves as a unique identifier for this specific top board of the BGA adapter, making it easy to identify and track in a professional environment.
The ZIF socket on the top board is designed for BGA64 packages in an OpenTop type configuration, providing a secure and efficient connection for programming or testing purposes.
The top board is designed to connect to the BGA-Bottom-X board, featuring 4 rows of 4×25 pins with a square shape and a pin pitch of 0.6×0.6mm, providing a standardized and compatible interface for connecting with the bottom board.
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