BGA-Top-67 ZIF

The top board of the BGA adapter with Ord. no. 70-0503 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameters, ball heights, and body thicknesses. The Accepted package(s) section of the picture shows the range of dimensions of BGA packages that are compatible with this BGA-Top board.

The ZIF socket on the top board is designed for high reliability, with an operating (mechanical) warranty of 10,000 actuations. This ensures that the socket can be used repeatedly for programming or testing BGA devices without compromising its performance.

The top board is made in Slovakia, adhering to high-quality standards to ensure reliable performance. The Ord. no. 70-0503 serves as a unique identifier for this specific BGA adapter top board, making it easy to identify and track in a professional environment.

The top board features a ZIF BGA48 OpenTop type socket, which is compatible with BGA packages that have 48 balls. The connection to the BGA-Bottom-X board is achieved through 4 rows of 4×25 pins, arranged in a square pattern with a pin spacing of 0.6×0.6mm. This allows for secure and reliable connection between the top and bottom boards during programming or testing of BGA devices.

It is important to follow the manufacturer’s guidelines for proper usage of the BGA adapter top board, including compatibility with specific BGA package dimensions and recommended pin spacing, to ensure correct functionality and avoid potential damage to the devices or the adapter.