BGA-Top-66 ZIF

The top board of the BGA adapter is designed to work with various BGA (Ball Grid Array) packages, accommodating differences in ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board is capable of accepting BGA packages with different dimensions, as shown in the picture at the Accepted package(s) section of the adapter.

The ZIF socket has an operating (mechanical) warranty of 10,000 actuations, ensuring its durability and reliability in repeated use. The adapter is manufactured in Slovakia and the order number is 70-0834.

The ZIF socket on the top board of the BGA adapter is specifically designed for BGA48 packages, using an OpenTop type socket. The connection to the BGA-Bottom-X is made through 4×25 pins, arranged in a square pattern with a pin pitch of 0.6×0.6mm. This configuration provides a secure and reliable interface for programming and testing BGA devices with 48 balls.

The BGA adapter is manufactured in Slovakia with high-quality materials and craftsmanship to ensure its performance and durability. It is a versatile tool for electronic engineers and technicians working with BGA devices, providing a reliable interface for programming and testing operations.