BGA-Top-61 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-0483 is designed to accept a wide range of BGA packages with different dimensions, including variations in ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter’s picture displays the range of dimensions of BGA packages that are compatible with this BGA-Top board.

The ZIF (Zero Insertion Force) socket of this adapter is designed for durability and reliability, with an operating (mechanical) warranty of 500,000 actuations. This ensures that the ZIF socket can withstand repeated use during programming or testing operations without compromising its performance.

The adapter is made in Slovakia, adhering to high-quality standards to ensure reliable performance. The Ord. no. 70-0483 serves as a unique identifier for this specific adapter, making it easy to identify and track in a professional environment.

The ZIF socket is of ClamShell type, featuring a depopulated array of 60 spring probes that provide a secure and reliable connection to the BGA package. The top board of the adapter features 4 rows of 4×25 pins, arranged in a square pattern with a pin spacing of 0.6×0.6mm. These pins are designed to provide efficient and reliable connectivity to the BGA package during programming or testing operations.

It is important to follow the manufacturer’s guidelines for proper usage of the BGA adapter to ensure correct functionality and avoid potential damage to the devices or the adapter. The high operating (mechanical) warranty of 500,000 actuations provides assurance of the durability and reliability of the ZIF socket, making it suitable for long-term use in professional environments.