BGA-Top-57 ZIF

The top board of the BGA adapter with Ord. no. 70-0466 features a ZIF (Zero Insertion Force) socket designed to accept various BGA (Ball Grid Array) packages with different ball diameter, ball height, and body thickness. The accepted package(s) range of dimensions is depicted in a picture provided by the manufacturer.

The ZIF socket on the top board has an operating (mechanical) warranty of 10,000 actuations, ensuring reliable and durable performance during repeated usage. The top board is made in Slovakia and meets high-quality standards for reliable operation.

The socket on the top board is a ZIF BGA56, OpenTop type, specifically designed for BGA56 packages. It allows for easy insertion and removal of the BGA package without applying excessive force, minimizing the risk of damaging the package or the adapter.

The connection to the BGA-Bottom-X board is through 4 rows of 4×25 pins, arranged in a square pattern with a spacing of 0.6×0.6mm. These pins provide a secure and reliable connection between the top and bottom boards of the BGA adapter, ensuring efficient communication and operation during programming or testing.

The Ord. no. 70-0466 serves as a unique identifier for this specific top board, making it easy to identify and track in a professional environment. It is important to follow the manufacturer’s guidelines for proper usage of the BGA adapter and the BGA packages to ensure correct functionality and avoid potential damage to the packages or the adapter.