The top board of the BGA adapter with Ord. no. 70-0462 features a ZIF (Zero Insertion Force) socket designed to accept various variations of BGA (Ball Grid Array) packages. These packages may differ in ball diameter, ball height, and body thickness. The top board is made in Slovakia and adheres to high-quality standards for reliable performance and durability.
The ZIF socket on the top board is of the ClamShell type, which allows for easy insertion and removal of BGA packages during programming or testing. The socket is designed to withstand repeated actuations, with an operating (mechanical) warranty of 500,000 actuations. This ensures a long service life and reliable operation during multiple programming or testing cycles.
The top board features 4 rows of 4×25 pins, arranged in a square pattern with a pin spacing of 0.6×0.6mm. These pins are designed to provide a secure and reliable connection between the top board and the BGA-Bottom-X, which is the bottom board of the BGA adapter. The pins facilitate efficient communication and operation during programming or testing of BGA packages.
The Accepted package(s) section of the BGA-Top board’s picture shows the range of all dimensions of BGA packages that are compatible with this adapter. It is important to verify the compatibility of the BGA packages with the ZIF socket and follow the manufacturer’s guidelines for proper usage to ensure correct functionality and avoid potential damage to the BGA packages or the adapter.
The Ord. no. 70-0462 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment.
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