BGA-Top-46 ZIF

The top board of the BGA adapter with Ord. no. 70-0621 is designed to accommodate BGA (Ball Grid Array) packages with up to 72 balls. The ZIF (Zero Insertion Force) socket on this top board accepts various variations of BGA packages, including those with different ball diameters, ball heights, and body thicknesses. The range of accepted package dimensions is depicted in the picture at the “Accepted package(s)” section.

The ZIF socket on this top board has an operating (mechanical) warranty of 10,000 actuations, providing reliable performance for multiple insertions and removals of BGA packages. The top board is made in Slovakia, known for its high-quality manufacturing standards, ensuring durability and reliability.

The Ord. no. 70-0621 top board features a ZIF BGA48 socket with an OpenTop type design. The connection to the BGA-Bottom board is established through 8×25 + 3×20 pins arranged in a square pattern with a pin pitch of 0.6×0.6mm. This configuration allows for a secure and efficient connection between the top and bottom boards, making it suitable for programming or testing applications involving BGA packages with up to 72 balls.

With its robust construction, wide compatibility with BGA packages, and reliable performance, the top board of this BGA adapter is an ideal solution for working with various BGA packages in a range of applications.