BGA-Top-44 ZIF (a)

The top board of BGA adapters with Ord. no. 70-0453A is designed to accommodate a wide range of BGA packages with varying ball diameter, ball height, and body thickness. The ZIF socket on this top board has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and reliability during repeated use.

The ZIF socket is a BGA256 (accepts package up to 289 balls) and features an OpenTop type design, allowing for easy insertion and removal of BGA packages during testing, programming, or other operations. The socket is designed to accept BGA packages with varying ball configurations and sizes within the specified range.

The connection to the BGA-Bottom-X on this top board features 8+3 rows of pins, with 8×25+3×20 pins arranged in a square pattern with a pin spacing of 0.6×0.6mm. This provides a reliable electrical connection between the top and bottom boards, enabling efficient communication and operation during testing or programming.

The top board is made in Slovakia to high-quality standards, ensuring reliable performance and durability. The Ord. no. 70-0453A serves as a unique identifier for this specific top board, making it easy to identify and track in a professional environment. The top board is compatible with s/n from 453A-00771 and supported from PG4UW software version 3.76, providing compatibility and integration with existing systems. It is important to verify the compatibility of the top board with the specific BGA packages and software version before proceeding with any operations to ensure proper functionality and avoid potential damage to the devices or the top board.