BGA-Top-41 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-0404 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages. These packages may differ in ball diameter, ball height, and body thickness. The accepted package dimensions are illustrated in the picture provided in the Accepted package(s) section of the adapter.

The ZIF socket on this top board is of ClamShell type, which provides a secure and reliable connection to the BGA package during programming, testing, or other operations. It features a depopulated array of 52 spring probes that ensure excellent electrical contact with the BGA package for efficient and accurate operations.

The top board also includes 4 rows of 4x 25 pins each, arranged in a square pattern with a pin spacing of 0.6×0.6mm. These pins are designed to connect with the corresponding pins on the bottom board of the BGA adapter (BGA-Bottom-X) to establish a reliable connection with the target device.

The ZIF socket on this top board has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and longevity during repeated usage. The adapter is made in Slovakia, ensuring high-quality manufacturing processes and materials.

The Ord. no. 70-0404 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment. Please note that it is important to verify the compatibility of the BGA package with the ZIF socket and the overall BGA adapter design before proceeding with programming or testing operations.