BGA-Top-32 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-0367 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The ZIF socket is a ClamShell type, which allows for easy insertion and removal of BGA packages during programming and testing operations.

The top board of the BGA adapter is designed to connect to the BGA-Bottom-X using 4 rows of 4x 25 pins each, arranged in a square pattern with a pitch of 0.6×0.6mm. This enables reliable and precise connections between the top board and the bottom board of the BGA adapter, ensuring accurate programming and testing of BGA devices.

The ZIF socket on the top board of the BGA adapter is capable of withstanding 500,000 actuations, providing a high level of durability and reliability in professional use. The BGA adapter is made in Slovakia using high-quality materials and manufacturing processes, ensuring its performance and longevity in demanding programming and testing applications. The Ord. no. 70-0367 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment. The picture at the Accepted package(s) section shows the range of all dimensions of BGA packages that are accepted by this BGA-Top board, providing a comprehensive overview of the compatibility of the adapter with various BGA packages.