BGA-Top-31a ZIF

The top board of the BGA adapter with Ord. no. 70-0369A features a ZIF (Zero Insertion Force) socket that is designed to accept various variants of supported BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The ZIF socket is an OpenTop type, which allows for easy insertion and removal of BGA packages during programming and testing operations.

The top board of the BGA adapter is designed to connect to the BGA-Bottom-X using 4 rows of 25 pins each, arranged in a square pattern with a pitch of 0.6×0.6mm. This enables reliable and precise connections between the top board and the bottom board of the BGA adapter, ensuring accurate programming and testing of BGA devices.

The ZIF socket on the top board of the BGA adapter is capable of withstanding 10,000 actuations, providing durability and reliability in professional use. The BGA adapter is supported from PG4UW software version 3.09b, ensuring compatibility and seamless integration with programming software. The BGA adapter is made in Slovakia using high-quality materials and manufacturing processes, ensuring its performance and longevity in demanding programming and testing applications. The Ord. no. 70-0369A serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment. The Accepted package(s) section provides information on the range of supported BGA package variations, including ball diameter, ball height, and body thickness, ensuring the versatility and flexibility of the BGA adapter for different BGA devices.