BGA-Top-23 ZIF-CS

The top board of the BGA adapter features a ZIF (Zero Insertion Force) socket that is capable of accepting various variations of BGA (Ball Grid Array) packages, including differences in ball diameter, ball height, and body thickness. The accepted package dimensions are shown in the picture at the “Accepted package(s)” section of the adapter.

The ZIF socket on the BGA-Top board has an operating (mechanical) warranty of 500,000 actuations, providing a reliable and durable solution for repeated use in programming and testing operations.

The BGA-Top board is made in Slovakia and is identified by Ord. no. 70-0311. It features a ZIF BGA64 socket with a depopulated array of 64 spring probes, designed in a ClamShell type configuration. The connection to the BGA-Bottom-X board is achieved through 4 rows of 4×25 pins, arranged in a square pattern with a pitch of 0.6×0.6mm, providing a reliable and efficient interface for programming and testing BGA64 devices.