The top board of BGA adapters with Ord. no. 70-1078 is designed to accept various BGA packages with different ball diameters, ball heights, and body thicknesses. This adapter is manufactured in Slovakia and is built to meet high-quality standards for durability and reliable performance.
The ZIF (Zero Insertion Force) socket on the top board of the adapter has an operating (mechanical) warranty of 10,000 actuations, providing a reliable and secure connection for testing, programming, and development of BGA56 packages. The ZIF socket is of OpenTop type, allowing for easy placement and removal of BGA56 packages.
The connection to the BGA-Bottom-X on this top board consists of 4×25 square pins with a size of 0.6×0.6mm, providing accurate alignment and electrical connectivity with the BGA56 packages. The top board of the adapter is designed to accept a wide range of BGA package dimensions, as depicted in the picture at the “Accepted package(s)” section, which includes variations in ball diameter, ball height, and body thickness.
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