The special adapter with Ord. no. 70-1010A is specifically assigned for eMMC (embedded Multi-Media Card) devices in BGA (Ball Grid Array) packages, designed for TurboMode. It is made in Slovakia and features a ZIF (Zero Insertion Force) socket of ClamShell type that accepts various variations of BGA packages, including those with different ball diameter, ball height, and body thickness. The accepted package dimensions are depicted in the picture at the Accepted package(s) section.
The ZIF socket of this adapter has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability. The connection to BGA-Bottom-X is through 4×25 pins in a square shape with dimensions of 0.6×0.6mm. This special adapter is designed to provide efficient and convenient interfacing with eMMC devices in BGA packages, particularly optimized for TurboMode operations.
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