BGA-Top-175 ZIF

The top board of BGA adapters with Ord. no. 70-0996 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages with different ball diameter, ball height, and body thickness. The accepted package dimensions are shown in the picture at the “Accepted package(s)” section of the board. This top board is made in Slovakia and comes with an operating (mechanical) warranty of 10,000 actuations for the ZIF socket. The socket type is ZIF BGA107, with an OpenTop design. The connection to the BGA-Bottom-X is made through 8×25 + 3×20 pins, which are square in shape and have dimensions of 0.6×0.6mm.