BGA-Top-164 ZIF

The top board of the BGA adapter is designed to work with ZIF (Zero Insertion Force) socket and is compatible with various BGA (Ball Grid Array) packages that differ in ball diameter, ball height, and body thickness. The Accepted package(s) section of the adapter shows the range of dimensions of BGA packages that are supported by this BGA-Top board.

The ZIF socket on the top board has an operating (mechanical) warranty of 10,000 actuations, providing a reliable and durable solution for programming and testing BGA devices.

The top board is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and durability. The order number for this top board of the BGA adapter is 70-0894, which can be used for easy identification and ordering.

The ZIF socket on the top board is designed for BGA108 packages and is of OpenTop type, providing a secure and reliable connection to the target BGA devices. The top board also features a connection to the BGA-Bottom-X using 8×25 + 3×20 pins arranged in a square pattern with a pitch of 0.6×0.6mm, ensuring accurate and efficient operations.

In summary, the top board of the BGA adapter is designed for BGA108 packages and features a ZIF socket with a mechanical warranty of 10,000 actuations. It is made in Slovakia and has an order number of 70-0894. The connection to the BGA-Bottom-X is made using 8×25 + 3×20 pins arranged in a square pattern.