The top board of the BGA adapter is designed to accommodate a wide range of BGA (Ball Grid Array) packages with variations in ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on the top board provides a reliable and efficient solution for programming and testing BGA144 packages.
The top board features a ZIF BGA144 socket in an OpenTop type configuration, allowing for easy insertion and removal of the target BGA package. The socket is designed to withstand up to 10,000 mechanical actuations, ensuring durability and reliability during repeated usage.
The connection to the BGA-Bottom-X is through 8×25 pins and 3×20 pins, arranged in a square pattern with a pitch of 0.6×0.6mm. This configuration provides a secure and reliable connection to the corresponding BGA-Bottom-X, ensuring accurate programming and testing of the target BGA144 package.
The top board is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and durability. The order number for this top board is 70-0887, which can be used for easy identification and ordering.
The top board of the BGA adapter is designed to accept a wide range of BGA packages with variations in ball diameter, ball height, and body thickness. It features a ZIF BGA144 socket, has a durable design with a mechanical warranty of 10,000 actuations, and is manufactured in Slovakia to high-quality standards.
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