The top board of BGA adapters with Ord. no. 70-0999 features a ZIF (Zero Insertion Force) socket that is designed to accept various variations of BGA (Ball Grid Array) packages, which may differ in ball diameter, ball height, and body thickness. The top board has a picture in the Accepted package(s) section that displays the range of dimensions of BGA packages that are compatible with this BGA-Top board. The ZIF socket has an operating (mechanical) warranty of 10,000 actuations. This top board is made in Slovakia and has a socket type of ZIF BGA324 with an OpenTop design. The connection to the BGA-Bottom-X is established using 8×50 + 2×50 pins with a B-T-B (Board-to-Board) connector with a pitch of 0.8mm.
Reviews
Clear filtersThere are no reviews yet.