The top board of BGA adapters is designed to accept various variations of BGA (Ball Grid Array) packages, including those with different ball diameter, ball height, and body thickness. The picture in the Accepted package(s) section displays the range of all dimensions of BGA packages that are compatible with this BGA-Top board.
The ZIF (Zero Insertion Force) socket on this BGA adapter features a ClamShell type design and is capable of accommodating BGA48 packages. The ZIF socket has a depopulated array of 48 spring probes, which provide a secure and reliable connection to the BGA package.
The operating (mechanical) warranty of the ZIF socket is 500,000 actuations, indicating its durability and suitability for repeated use. The BGA adapter is made in Slovakia and is identified by Ord. no. 70-0272.
The connection to the BGA-Bottom-X is through 4 rows of 4×25 pins, arranged in a square pattern with a pitch of 0.6×0.6mm (600 mil). This allows for a reliable and efficient connection to the BGA package.
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