BGA-Top-131 ZIF-CS

The top board of BGA adapters with order number 70-0725 features a ZIF (Zero Insertion Force) socket designed to accept various BGA (Ball Grid Array) packages that differ in ball diameter, ball height, and body thickness. The accepted package(s) are shown in the picture, indicating the range of dimensions of BGA packages that can be used with this BGA-Top board.

The ZIF socket on this top board has a ClamShell type design, which allows for easy insertion and removal of the BGA package during programming and testing processes. It features a depopulated array of 64 spring probes, making it compatible with BGA80 packages.

The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, ensuring durable and reliable performance during repeated use. The mechanical warranty guarantees the longevity and durability of the ZIF socket, making it suitable for high-volume programming and testing operations.

This top board of BGA adapters is manufactured in Slovakia to high-quality standards, ensuring reliable performance and durability. The order number for this adapter is 70-0725. The connection to the BGA-Bottom-X features 4 rows of 4×25 pins arranged in a square configuration, with a pin pitch of 0.6×0.6mm. This connection provides precise and secure connections to the programming or testing equipment, ensuring accurate and efficient programming and testing of BGA packages.

With its ZIF socket with ClamShell design, operating (mechanical) warranty of 500,000 actuations, and compatibility with various BGA packages, this top board of BGA adapters offers a reliable and efficient solution for programming and testing of BGA packages with different dimensions and specifications.