The top board of the BGA adapter with Ord. no. 70-0612 features a ZIF (Zero Insertion Force) socket designed to accept various variations of BGA (Ball Grid Array) packages. The accepted BGA packages may differ in ball diameter, ball height, and body thickness. The BGA-Top board is equipped with a ZIF socket of ClamShell type, which provides easy insertion and removal of the BGA64 package without the need for any additional tools.
The ZIF socket on the BGA-Top board has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during repeated use. This makes it suitable for high-volume production environments where frequent socket actuations are required.
The BGA-Top board is made in Slovakia, known for its high-quality manufacturing standards, ensuring reliable performance. The Ord. no. 70-0612 adapter is a specialized solution for programming or testing BGA64 packages, and it is designed with efficient connection to the BGA-Bottom board using 4×25 pins in a square pattern with a pin pitch of 0.6×0.6mm. The BGA-Top board is a versatile and reliable solution for BGA package programming or testing applications.
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