BGA-Top-107 ZIF

The top board of the BGA adapter with Ord. no. 70-0614 features a ZIF (Zero Insertion Force) socket designed to accept various variations of BGA (Ball Grid Array) packages. The accepted BGA packages may differ in ball diameter, ball height, and body thickness. The BGA-Top board is equipped with a ZIF socket of OpenTop type, which provides easy insertion and removal of the BGA48 package without the need for any additional tools.

The ZIF socket on the BGA-Top board has an operating (mechanical) warranty of 10,000 actuations at room temperature, ensuring durability and reliability during repeated use. This makes it suitable for applications where moderate socket actuations are expected.

The BGA-Top board is made in Slovakia, known for its high-quality manufacturing standards, ensuring reliable performance. The Ord. no. 70-0614 adapter is designed with efficient connection to the BGA-Bottom board using 4×25 pins in a square pattern with a pin pitch of 0.6×0.6mm. The BGA-Top board is a versatile and reliable solution for BGA package programming or testing applications, particularly for BGA48 packages.