BGA-Top-106 ZIF-CS

SKU: ELNx2540
SKU: ELNx2540 Category:

AED 4,626.39

Type ETA Cost
Inside UAE 2 - 3 Days 22 AED
Pickup 1 Day Free
International 4 - 7 Days 100 AED
  • International Delivery

International

4 - 7 Days

Will be calculated at checkout

  • Self Pickup

Pickup

Sameday

Free

  • Inside UAE Delivery

Inside UAE

2 - 3 Days

AED 29/-

Payment Methods:

The top board of the BGA (Ball Grid Array) adapters is designed with a ZIF (Zero Insertion Force) socket that is capable of accepting various variations of BGA packages, which may differ in ball diameter, ball height, and body thickness. The Accepted package(s) section of the board features a range of dimensions that are compatible with this BGA-Top board.

The ZIF socket used in the top board is a ClamShell type, providing a convenient and secure mechanism for inserting and removing BGA packages. It is capable of withstanding repeated actuations, with an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during use.

The top board is manufactured in Slovakia and is identified by the order number 70-0642. It is designed with 8+3 rows, featuring 8×25+3×20 pins in a square layout with a dimension of 0.6×0.6mm, allowing for seamless connection to the BGA-Bottom-X, facilitating effective interconnectivity between the top and bottom boards of the BGA adapter.

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