BGA-Top-103 ZIF-CS

The top board of the BGA adapter is designed to provide a reliable solution for programming and testing BGA100 devices. The ZIF socket on the top board accepts various variations of BGA packages, including different ball diameters, ball heights, and body thicknesses. The Accepted package(s) section of the adapter provides a picture that shows the range of all dimensions of BGA packages that are accepted by this BGA-Top board, ensuring compatibility with a wide range of BGA devices.

The top board is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0970 for easy identification and ordering. It features a ZIF (Zero Insertion Force) socket with a ClamShell type, which allows for easy insertion and removal of BGA100 devices without applying excessive force, minimizing the risk of damage.

The connection to BGA-Bottom-X on the top board features an 8×25 + 3×20 pin configuration, with square pins measuring 0.6×0.6mm, providing a reliable and accurate connection to the bottom board of the BGA adapter. The top board is designed for durability, with an operating (mechanical) warranty of 500,000 actuations, ensuring a long-lasting and reliable performance.

With its versatility, durability, and high-quality manufacturing, the top board of the BGA adapter with ZIF BGA100 ClamShell type socket is a dependable solution for programming and testing BGA100 devices. It is made in Slovakia with an order number of 70-0970, providing assurance of its quality and performance.