This heat sink is designed to reduce the risk of hardware failure caused by overheating. Its high-density fins are in contact with the cooling air, maximizing surface area and providing for effective heat transfer. With 14 fins, the heat sink is ideal for a range of applications, including computers, power transistors, FETs, ICs, power amplifiers, voltage regulators, MOSFETs, and SCRs. However, it is important to ensure that the size of the heat sink matches the component to be cooled for optimal performance.

Dimensions:

50 x 50 x 20 mm/ 1.97 x 1.97 x0.78 Inch (L*W*T)